Soldering & Surface Mount Technology

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.

The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.

《Soldering & Surface Mount Technology》是一本由Emerald Group Publishing Ltd.出版商出版的专业工程技术期刊，该刊创刊于1981年，刊期Quarterly，该刊已被国际权威数据库SCIE收录。在中科院最新升级版分区表中，该刊分区信息为大类学科：工程技术 4区，小类学科：冶金工程 2区；工程：电子与电气 3区；工程：制造 3区；材料科学：综合 3区；在JCR（Journal Citation Reports）分区等级为Q3。该刊发文范围涵盖工程：电子与电气等领域，旨在及时、准确、全面地报道国内外工程：电子与电气工作者在该领域取得的最新研究成果、工作进展及学术动态、技术革新等，促进学术交流，鼓励学术创新。2021年影响因子为1.494，平均审稿速度>12周，或约稿。

大类学科	分区	小类学科	分区	Top期刊	综述期刊
材料科学	3区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 METALLURGY & METALLURGICAL ENGINEERING 冶金工程 ENGINEERING, MANUFACTURING 工程：制造	3区 3区 3区 4区	否	否

JCR分区等级	JCR所属学科	分区	影响因子
Q3	METALLURGY & METALLURGICAL ENGINEERING	Q3	1.494
	MATERIALS SCIENCE, MULTIDISCIPLINARY	Q4
	ENGINEERING, ELECTRICAL & ELECTRONIC	Q4
	ENGINEERING, MANUFACTURING	Q4

影响因子	h-index	Gold OA文章占比	研究类文章占比	OA开放访问	平均审稿速度
1.494	28	0.89%	100.00%	未开放	>12周，或约稿